The next-generation platform for transceivers, electronic photonic integrated circuits (EPICs) are now in mass production, promising higher capacities, better performance and lower costs than traditional free-space optical designs.
But packaging these EPICs into usable assemblies and pluggable modules presents various challenges – which is why we have developed a packaging service for a range of silicon photonics requirements. These include transmit (TX), receive (RX) and TXRX subassemblies, as well as full transceiver packaging.