COB / Freespace Assembly
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Broadex Technologies can provide the following packaging services:


  • Die Bond: High precision fully automated die attach. Accuracy ±5μm. Supports eutectic and epoxy die attach as well as flip chip.
  • Wire Bond: High speed fully automated wire bonding. Accuracy ±2μm. Supports ball bonding and handles various wire lengths and configurations.



Free Space

  • Our highly experienced engineering team can provide optical simulations, as well as design and assembly of a wide variety of optical devices, including WDM modules, isolators, collimators, BOSAs and transceivers.


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