Our company
As new communication technologies and systems such as 5G, cloud and IoT change people’s lives, we create the innovative components needed to achieve the data rates and network capacity vital for a connected future.
The latest developments in telecommunications and data communications rely on advanced optoelectronic components. As a leading provider of these components, we design, develop and mass produce a wide range of passive and active fiber-optic products for long-haul, metro and access networks, wireless networks, and datacenter optics.
Since starting out in 2003, we have developed a unique range of technologies that set us apart in the telecommunications market.
For data center applications, Broadex Technologies offers both optical (MM/SM transceivers and AOC) and copper (DAC and ACC) high speed connectivity solutions up to 400G. We pioneered the development of 10G PON Combo OLT modules and are the largest manufacturer of these transceivers in China, including our XG/XGS/Combo for FTTH.
Broadex has invested heavily in commercialization of Silicon Photonics technology, developing 25G/50G transceivers for 5G front-haul as well as our 400G modules. This ground breaking work in the use of silicon photonics for manufacturing high-speed transceivers positions us to meet the increasing demand for faster, smaller and more power-efficient devices.
Our world-leading silica-on-silicon planar lightwave circuit (PLC) manufacturing platform is vertically integrated from PLC chip design and fabrication to module assembly, enabling us to be a leading global provider of DWDM (AWG, VMUX) and optical power-splitting components.
As we focus on providing advanced optoelectronic products to the fiber-connected world, we will continue to aim for the highest levels of innovation and technological leadership. Each and every day, Broadex Technologies strives to innovate and better serve customers in the pursuit of ever faster and ubiquitous fiber optical communications.
Our Technologies
Silica-on-silicon PLC
Our silica-on-silicon planar lightwave circuit (PLC) fabrication on 8-inch wafers provides the lowest insertion loss of all photonic integrated circuit (PIC) technologies – critical in all telecommunications networks – while ensuring maximum capacity, cost-effectively.
Arrayed Waveguide Gratings (AWGs)
We design and manufacture advanced arrayed waveguide gratings (AWGs) to help you get the most out of your DWDM network.
Athermalization
Our athermalization technology enables cost-effective, reliable and truly passive operation of PLC devices in DWDM networks, across a wide temperature range with no power needed.
Mach-Zehnder Interferometer (MZI)
Allowing for less strict tolerances on other components in the network, our patented Mach-Zehnder Interferometer (MZI) technology reduces costs, while providing low insertion loss with high channel uniformity and reliability.
Bidirectional AWG (cyclic)
Our bidirectional cyclic AWGs dramatically reduce the amount of fiber needed to deploy a network and halves the number of AWGs required.
Transceiver Packaging
Broadex can supply a wide variety of transceiver packaging types and is working to further integrate the optical and electrical assemblies in Co-Packaged Optics (CPO) modules.
COB
Chip On Board (COB) is a relatively new packaging technology and the preferred choice for high volume manufacturing of transceiver modules.
Free Space
Free Space Optics (FSO) is a mature packaging technology that is widely used today.
Silicon Photonics
Silicon Photonics technology uses semiconductor chip fabrication technology to create photonic circuits. Broadex believes that it represents the future of both optical and microelectronics industries.
Our Services
PLC Chip Design & Manufacturing
All the silica PLC devices we manufacture are designed in-house. With over 40 years’ combined experience in PLC design, we specialize in translating parametric device requirements into high-performance custom devices.
AR Coatings
Our thin-film coating chambers, with both electron-beam evaporation and ion-beam-assisted deposition technologies, provide cost-effective, high-performance coatings.
Fiber Array Design and Manufacturing
We have been designing and manufacturing quality fiber arrays since our formation in 2003.
Silicon Photonics Packaging
We offer packaging services for a wide range of silicon photonics requirements from chip scale integration up to full modules.
MEMS & Hermetic Package Design
Using a range of techniques, we can design and produce hermetic packaging for virtually any requirement.
COB / Freespace Assembly
Broadex Technologies’ highly experienced engineering team can provide a comprehensive suite of design and assembly services for both COB and Free Space packaging.
Company Timeline
Where we are
Our headquarters are in Jiaxing, China, and we have R&D and manufacturing facilities in Shanghai and Chengdu, as well as in Edinburgh, UK. Broadex Technologies is publicly listed on the Shenzhen Stock Exchange #300548.
